Magnetron Sputtering Cathodes

Click to Enlarge

MAIN FEATURES: Compact and easy to install design. High strength rare earth magnet module allows sputtering of permeable materialsupto 3 mm thickness Compatibility with dc, pulsed dc or rf operation. High sputtering rate coupled with excellent target utilization. Integrated argon gas inlet assembly. Optimized turbulent water flow to provide uniform target cooling. Low operating pressures. Flexibility to accept target in 'clamp on' or 'bonded' configuration to cover broad range of thicknesses down to foils. External or internal mounting optional. UBM option available in all categories. UHV compatible sources are also available Integrated shutter assembly.

‘MILMAN’ make magnetron sources have been designed with the philosophy of offering complete flexibility to user without compromising excellent performance characteristics. The sources offer capability of deposition of high quality pure films from conducting or insulating target materials. The high strength rare earth magnet module ensures high sputtering rates rendering high productivity. The magnetic field in these cathodes is carefully shaped using powerful techniques of FEA (Finite Element Analysis) to realize excellent target utilization coupled with uniform erosion track. The cathodes are compatible for both DC and RF operation and are available in wide range of standard circular as well as rectangular geometries. Sources can be offered in custom-built configuration to suit existing deposition platforms. They are easy to install and can be adapted to any system without loss in performance.

The cathodes are supplied in standard flange mounted configuration for quick adaptability to standard PVD equipment. However, cathodes can be supplied in custom-built configuration to adapt any existing system requirement. Internally mounted cathodes are also available for compatibility with any system and to offer design flexibility to system designer.

The cathodes are supplied in standard flange mounted configuration for quick adaptability to standard PVD equipment. However, cathodes can be supplied in custom-built configuration to adapt any existing system requirement. Internally mounted cathodes are also available for compatibility with any system and to offer design flexibility to system designer.

Cathode assembly can accept the source target in range of thicknesses down to thin foils. The target can be installed directly on water cooled copper surface by a SS304L/316 clamping ring which allows for quick change of targets for different applications. Alternatively the targets can be bonded to OFHC copper backing plate which is then secured on water-cooled copper surface in 'Bolt-On' configuration.

Water cooling in these sources is essentially directional and turbulent in nature. This ensures the uniform cooling of the target plate without creation of any hot spots during sputter deposition. Water cooling is provided to a thin integrated copper plate on which a target is secured in a 'Clamp-On' or a bonded fashion.

Metallic or conducting target sources can be adequately sputtered using DC power supply. In order to sputter electrically insulating target sources, it is essential to provide RF power. Pulsed DC power supplies have also found their usefulness in this category. MILMAN make magnetron sources are universally compatible to all types of power supplies without any modification or cost consideration.

In sputter deposition, films sputtered at lower pressures always exhibit better quality in terms of purity and reduced trapped Argon gas molecules. All MILMAN make magnetron cathodes come with integrated Argon gas inlet assembly, which replenishes fresh argon in the proximity of the surface being sputtered. This allows for lower overall process pressures and also minimizes oxide formation on the target surface.

Sputtering rate for Copper**
- At 40mm source to Substrate distance - 0.8 m/min.
- At 115mm source to Substrate distance - 0.17 m/min.

* The technical specifications are provided for model MMCC3DBN source for other models. The specifications can be provided on request some details can however be derived from the table.

** MMCC3DBN source at 5 x 10-3 Torr and 600W of DC power

NOTE: MILMAN keeps the right to modify the technical design of the equipment if deemed necessary, however, without reducing the capability of the equipment.

Magnetron Sputtering Cathodes often suffer setback because of typical arrangement of Magnets designed for high rate of deposition. This arrangement usually causes accelerated local erosion leading to trenching on the sputtered surface. The source target becomes useless as the trench depth reaches back surface. The accelerated local erosion occurs because of localized high values of magnetic field component parallel to the target surface, which results in plasma pinching effect at the erosion racetrack. This phenomenon is avoided by introducing thin steel plate at a position between target and the magnets. The steel plate has an effect of quenching some magnetic field, thereby reducing the peak values of magnetic fields. Flattening of the peaks in magnetic field minimizes the possibility of trenching effects leading to enhanced utilization of target. This phenomenon is explained with following schematic.

All MILMAN make magnetrons are based on this shunted design to reach one of the highest target utilization figures.

Conventional design with Natural magnetic field	Shunted design with shaped magnetic Field by use of steel shims

Eg.: MMCR-DBN would stand for :

Magnetron Cathode Rectangular /DC operation / Bonded Target / Normal Magnetron and mention the length in the order separately.

*** Size in inches corresponds to diameter in case of circular. All rectangular geometries have standard width of 5 inches. Smallest size available is 5" * 8". In case of rectangular geometry, put a – after R and mention the length separately.