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Confocal Sputtering System

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Equipment provides for magnetron sputtering in sputter down geometry. Multiple circular cathodes are located in confocal configuration. Magnetron sputtering cathodes of 2”, 3”, and 4” diameter can be provided in this equipment. Number of cathode positions can be from 2 to 5 depending on whether ion gun or any other accessory is integrated in equipment.

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MAIN FEATURES:

Circular magnetron cathodes arranged in confocal geometry.
Sputter down Configuration with choice of cathode size and type.
Unique design of MILMAN make magnetron sputtering cathode assemblies with rare earth magnets for high target utilization.
Closed loop pressure control electronics for precise process pressure control.
Precision mass flow controller for process consistency.
Substrate heating up to 600ºC.
Substrate rotation upto 10-30 rpm along with change of sources to substrate distance.
Substrate tilt can be provided on request.
RF and DC along with Pulsed DC power supplies for sputtering both metals and insulators.
Complete PLC / PC based automation with recipe programming, alarm management and trends/report generation.