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Home
Products
Lab Systems for R & D
Lab Systems for R & D
E-Beam Evaporator
Bench Top Coater
Triple Magnetron Sputtering System
Plasma Enhanced Deposition System
Reactive Ion Etching System
Rapid Thermal Processor
Lab Systems for R & D
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E-Beam Evaporator
Provides common platform for thermal evaporation and electron beam evaporation with indexable four sources
All stainless steel (ss304) construction of vacuum chamber valves and plumbing lines along with all viton
©
o'rings and seals
State of the art quartz ir lamp based substrate heating mechanism
Plc-pc based automation for complete process control
Glow discharge plasma cleaning facility for precleaning of substrates
All interlocks for cooling water, low vacuum, compressed air failure etc. for safe operation
Bench Top Coater
Option of 3” / 4” magnetron sputtering cathode*
Quartz infra red lamp based substrate heater and rotation facility.
Substrate bias capability (optional).
Flexibility of manual, semiautomatic or complete plc based automation.
User friendly controls with active mimic displays for vacuum status.
Triple Magnetron Sputtering System
Choice of dc, pulsed dc and/or rf sputtering.
Substrate rotation to give high uniformity.
Quartz ir lamp based substrate heater control.
PLC-PC based automation for complete process control
Reactive Ion Etching System
Anodized aluminium based planar electrode assembly for uniform gas flow dynamics
Interchangable substrate holder assembly to accommodate various substrate sizes
Rapid Thermal Processor
Controlled process at 1200°c.
Ramp rates of 220°c/sec.
Temperature uniformity over wafer surface within ± 2%.
