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Plasma Enhanced Deposition System

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MAIN FEATURES:

Planar electrode assembly for uniform gas flow dynamics
Interchangable substrate holder assembly to accommodate various substrate sizes
Fully manual / semi-automatic [timer based] controls with upgradability for fully automatic PLC/PC based control with recipie programming
Gas manifold with Mass Flow Controller [MFC] for precise process control
Capacitance diaphragm Gauge and Variable Conductance Valve for Closed Loop Pressure control
RF power source with continuously variable power control for process optimization
Pulsed DC source with facility of voltage, frequency and duty cycle control
High reliability and low maintainance