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MAIN FEATURES:
Desiged for multilayered coatings for range of applications
Equipment with integrated arc and magnetron sputtering technology for greater flexibility
High loading capacity substrate table also allows for quick loading/unloading
PC-PLC-controlled automatic processing; provides for consistent coatings quality and colour reproducibility from batch to batch
rectangular cathodes in facing configuration for high coating uniformity.
Unbalanced magnetron sputtering technology for deep penetrating plasma
Low and easy maintenance
High system availability
Short process cycle
Versatility to deposit decorative coatings of TiN, TiCN, TiN / Gold, ZrN, CrN, CrCN etc.
