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Mini PVD Station is compact Table Top platform designed to use some of the major PVD technologies in the same process chamber / set up without purchase of separate independent and expensive PVD equipment for each category. Mini PVD Station offers researcher an exceptionally versatile tool for nascent as well as time bound projects. System configuration can be changed quickly by changing source / substrate flanges while the suitable operating software can be run from appropriate flash drive.
  • Compact standalone Table Top model
  • Universal platform to provide for
    • Magnetron Sputtering Technology
    • Plasma Enhanced Chemical Vapor Deposition (PECVD)
    • Reactive Ion Etching (RIE)
    • Plasma Ashing
    • Plasma Surface Activation
    • Thermal Evaporation
  • Turbo molecular pump to provide fast and clean oil free high vacuum.
  • User friendly front panel color LCD based touch screen HMI control.
  • Substrate heating facility up to 250°C.
  • PlC based process automation with recipe management
  • Low footprint with universal single phase input power
  • Limited utilities requirement
  • “CE” certification
  • Thin Film physics
  • Sensors and Actuators
  • MEMS technology
  • Solar Cells
  • Plasma sterilization
  • Plasma surface activation
  • Plasma Based High End Lithography (RIE and Plasma Etching)
  • Plasma Ashing
  • Metallization for contacts
  • Magnetic thin films
  • Ceramic Coatings
Technical Specifications of various configurations Magnetron sputtering (Single Cathode Configuration)
  • 2” / 3” Magnetron sputtering Cathode with motorized shutter.
  • Sputter down configuration.
  • Substrate holder for 1” diameter sample (2” optional)
  • Substrate heating up to 250º C
  • 700 W Pulsed DC power supply with active arc suppression (RF P/S optional)
  • Process control with HMI
Thermal Evaporation
  • Single source with electrically operated shutter
  • Source to substrate distance – 200 mm
  • Substrate Holder 2” x 2” or 3” Diameter with an array of tapped holes to mount different sizes of substrates
  • Substrate heating up to 250° C
  • 200 Amp 10 Volt SCR Controlled L.T. Power Supply
  • Programmable Current ramping facility
  • Glow Discharge Cleaning facility
  • Process control with HMI
  • Dual as well as Multi-turret with 4 thermal sources (Optional)
Plasma Treatment configuration
  • Parallel plate configuration
  • Substrate size 1” / 2” diameter
  • 300 W RF power supply
  • CFD based gas flow design
  • Closed loop pressure control
  • Specially designed gas inlet and evacuation to ensure laminar flow

Table top Sputter Coater

  1. Single Cathode configuration 
  2. Dual Cathode configuration

This is one of the most versatile and sought after configuration of Table Top platforms. Availability of two magnetron cathodes allow deposition of multi-layered structures as well as films with tailor made composition of two component systems.

Main Features:

  • Two cathodes of 2 “ diameter
  • Confocal configuration for better uniformity
  • Choice of Pulsed DC / RF power supplies
  • Substrate heating up to 250º C
  • Process control with HMI